Nelco RCC PTFE Custom PCB Manufacturer 650mm*1130mm Max Board Size

Versatile PCB Manufacturing: Diverse Materials & Advanced Processes

PCB Manufacturing Introduction:

Explore our comprehensive PCB manufacturing capabilities with a range of insulation materials including FR4, aluminum, copper, ceramic, PI, and PET. From 1 to 12-layer designs, our factory offers finished plate thickness starting at 0.07mm (with tolerance +5%/-6%). The inner layer copper thickness spans 18-70μm, while the outer layer boasts 20-140μm for optimum conductivity.

Choose from an array of solder-resist colors and lettering options for personalized aesthetics. Our advanced surface treatments include anti-oxidation, HASL, immersion gold, and more. Embark on innovative ventures with specialized processes such as thick copper plating, impedance control, and single-layer copper foil gold finger plates. Reinforce with Pl, FR4, steel, M glue, or electromagnetic shielding film.

Experience the freedom to design within a maximum size of 50mm x 100mm, while maintaining precision with outer/inner line width and spacing of 0.065mm/3mil. Achieve excellence with minimum solder resist ring width, solder bridge width, solder mask window, and aperture specifications. Our products ensure 10% impedance tolerance and adhere to shape tolerances of +0.05mm G laser +0.005mm.

Select from forming methods like V-cut, CNC, and punching to meet diverse fabrication needs. Unveil the future of electronics with our dynamic, high-quality PCB solutions.

PCB Manufacturing Parameters:

PCB Manufacturing Process:

1. Gold-plating process: the vertical HASL process is very difficult to flatten very thin pads, which brings difficulty to SMT placement. In addition, the shelf life of the HASL is very short, and gold-plating just solves the problem. these problems.

2. Immersion gold process: The purpose of the immersion gold process is to deposit a nickel-gold coating with stable color, good brightness, flat coating and good solderability on the surface of the printed circuit board. Basically, it can be divided into four stages: pre-treatment (oil extraction, micro-etching, activation, post-immersion), nickel immersion, gold immersion, and post-treatment (waste gold washing, DI washing, drying)

3. Leaded HASL: Leaded eutectic temperature is lower than lead-free, the specific amount depends on the composition of the lead-free alloy, such as the total gold of SNAGCU 217 degrees, the soldering temperature is the eutectic immersion plus 30 degrees or 50 degrees, It depends on the actual adjustment, the lead eutectic is 183 degrees, the mechanical strength, brightness, etc. are better than lead-free.

4. Lead-free HASL: lead will increase the activity of tin wire in the soldering process, lead-tin wire is better than lead-free tin wire, but lead is poisonous, long-term use is not good for human health, and lead-free tin will It is brighter than lead-tin melting, so the solder joint is much stronger.

5. SOP (anti-oxidation): It has anti-oxidation, thermal shock resistance, and corrosion resistance. It is used to protect the copper surface from rusting (oxidation or carbonization) in a normal environment: but in the subsequent welding high temperature, this protection The film must be easily removed quickly by the flux so that the exposed clean copper surface can be melted and soldered immediately in a short time to become a firm solder joint.

PCB Manufacturing Advantages:

1. From PCB proofing to SMT placement, one-stop solution, reducing R&D costs and accelerating product launch.

2. Quick quotation and quick response.

3. The delivery date is fast, and the on-time delivery rate is over 95%

4. Excellent materials, advanced equipment, and strict quality system 5. Exclusive customer service one-to-one service, seamless connection throughout the process