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Automotive Electronics PCB Manufacturing 2 - 64 Layers Immersion Gold + OSP
PCB Manufacturing Description:
1. Support a wide range of PCBs: high-layer, multi-layer, rigid-flex, high frequency, high speed, etc.
2. Seamless link from prototype to mass production.
3. flexible boards, rigid-flex boards, multi-layer boards, blind-hole boards, and thick copper and aluminum boards.
PCB Manufacturing Parameters:
Item | Technical Parameter |
Layer | 2-64 |
Thickness | 0.3-6.5mm |
Copper Thickness | 0.3-12 oz |
Min Mechanical Hole | 0.1mm |
Min Laser Hole | 0.075mm |
HDI | 1+n+1,2+n+2,3+n+3 |
Max Aspect Ratio | 20:01 |
Max Board Size | 650mm*1130mm |
Min Width/Space | 2.4/2.4mil |
Min Outline Tolerance | ±0.1mm |
Impedance Tolerance | ±5% |
Min PP Thickness | 0.06mm |
Bow &Twist | ≤0.5% |
Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
Special Capability | Gold Finger Plating, Peelable, Carbon ink |
PCB Manufacturing Introduction:
Tongzhan has always adhered to the principle of customer first. We serve customers, and customers are always the first. Customer-centric, diligent, innovative, honest, happy, and transparent; Customer-centric, professional, efficient, and win-win.
Our people are passionate, passionate about science, and passionate about technology, and we are all passionate about building a company that is known all over the world.
FAQ:
Q: Do you have MOQ restrictions?
We do not have any limit on order quantity and can support samples and mass production. The specific situation depends on the needs of customers and can be communicated with the staff.
Q: What are the special capabilities of printed circuit board assembly?
Gold finger, peelable, carbon ink.